Emerald Group Publishing Limited
Copyright © 2008, Emerald Group Publishing Limited
Article Type: Conferences, training and publications From: Pigment & Resin Technology, Volume 37, Issue 4
2008 Sealing technology for packaging processes seminar dates
Comprehensive two day seminar explores various sealing methods and offers practical problem solving techniques, 5-6 August 2008 Cleveland, OH. 18-19 November 2008, Philadelphia, PA.
Seminars for engineers, a division of Sensor Products Inc., announces in association with D3 Consulting the 2008 dates for its Sealing Technology for Packaging Processes seminar. Focusing on the various methods for applying heat to flexible and semi-rigid packaging in order to achieve quality seals, Sealing Technology for Packaging Processes covers various sealing technologies, seal testing procedures, adhesive sealing, polymer film and foil characteristics, and process/package validation.
Instructor Duncan Darby, President of D3 Consulting and Associate Professor for the Packaging Science Department at Clemson University, is a recognized expert in the use and manufacture of flexible packaging with over 20 years of experience in the flexible packaging industry.
Any personnel in the R&D, testing, process, design, fabrication and manufacturing of food, pharmaceutical, medical, cosmetic, chemical, veterinary or industrial product packaging can benefit from this unique course. Packaging, film and foil personnel will also benefit.
Information about this and technical seminars in other locations is available at: www.SeminarsForEngineers.com/packaging, by e-mailing: info@SeminarsForEngineers.com, or by phoning: 1.877.755.2272 (USA).