(2012), "BTU Internationals TRITAN™ HV90 metallization firing system exceeds industry specification for yield", Microelectronics International, Vol. 29 No. 2. https://doi.org/10.1108/mi.2012.21829baa.019Download as .RIS
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BTU Internationals TRITAN™ HV90 metallization firing system exceeds industry specification for yield
Article Type: New products From: Microelectronics International, Volume 29, Issue 2
BTU International, Inc. have said that their TRITAN™ HV90 dual-lane metallization firing system exceeds industry standards for wafer breakage. The three-belt, three-speed system boasts a yield better than 99.99 per cent, exceeding the industry standard for metallization firing.
The TRITAN HV90 dual-lane metallization firing system features increased throughput at 3,600 wafers per hour, an edge belt, volatile organic compound (VOC) abatement and a single zone spike with less than 3 s spike time. The TRITAN metallization firing system features BTU’s unique TriSpeed™ technology, allowing users to take advantage of superior ramp rates – up to 200°C/s – while not compromising the drying and cooling sections of the profile. The three-belt, three-speed system provides revolutionary control of profile development. In trials, TRITAN has consistently shown an improvement in fill factor, resulting in increased efficiency.
Web site: www.btu.com