TSMC 28 nm technology in volume production

Microelectronics International

ISSN: 1356-5362

Article publication date: 4 May 2012



(2012), "TSMC 28 nm technology in volume production", Microelectronics International, Vol. 29 No. 2. https://doi.org/10.1108/mi.2012.21829baa.001



Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited

TSMC 28 nm technology in volume production

Article Type: Industry news From: Microelectronics International, Volume 29, Issue 2

Taiwan Semiconductor Manufacturing Company (TSMC) reported that its 28 nm process is in volume production and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28 nm node.

TSMC’s 28 nm process offering includes 28 nm high performance (28HP), 28 nm high performance low power (28HPL), 28 nm low power (28LP) and 28 nm high performance mobile computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use.

The number of customer 28 nm production tapeouts has more than doubled as compared with that of 40 nm. At 28 nm, there are currently more than 80 customer product tapeouts. The TSMC 28 nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers. TSMC’s 28 nm design ecosystem is available through its Open Innovation Platform®, with qualified EDA design tools and third-party intellectual property (IP) ready for customer designs.

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