TY  - JOUR
AB  - 
VL  - 28
IS  - 3
SN  - 1356-5362
DO  - 10.1108/mi.2011.21828caa.019
UR  - https://doi.org/10.1108/mi.2011.21828caa.019
PY  - 2011
Y1  - 2011/01/01
TI  - Fine-pitch bump adapters from Aries allow for SMT adaptation of TSSOP, QFP and other fine-pitch devices
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/20
ER  -