Fine-pitch bump adapters from Aries allow for SMT adaptation of TSSOP, QFP and other fine-pitch devices

Microelectronics International

ISSN: 1356-5362

Article publication date: 2 August 2011

Citation

(2011), "Fine-pitch bump adapters from Aries allow for SMT adaptation of TSSOP, QFP and other fine-pitch devices", Microelectronics International, Vol. 28 No. 3. https://doi.org/10.1108/mi.2011.21828caa.019

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited


Fine-pitch bump adapters from Aries allow for SMT adaptation of TSSOP, QFP and other fine-pitch devices

Article Type: New products From: Microelectronics International, Volume 28, Issue 3

Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, offers a line of adapters which convert TSSOP, QFP and other fine-pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4-mm pitch.

These unique fine-pitch bump adapters are mounted to the existing PCB via raised pads up to 0.010″ (0.25 mm) on the adapter bottom. The adapters feature pads on the component side designed to accept any device on any pitch (0.5 mm or greater) and easily route the signals for packages including TSSOP, QFP and other fine-pitch devices down to 0.40 mm.

In addition to simple circuit correction, other active or passive components can be added to the adapter to facilitate a more complex or custom adaptation via the open space available at the top of the adapter board. This extra available space allows for easy conversion of the original design saving both time and money.

The Aries’ fine-pitch bump adapter boards are 0.032″ (0.813 mm) thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask-defined (NSMD) pads are finished with electroless nickel immersion gold. The adapters can operate up to 221°F (105°C) for FR4 and 266°F (130°C) for lead-free.

The new adapters are available in tape and reel for high-speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003″ (0.076 mm) can be used.

Fine-pitch bump adapters are available in panelised form, as an adapter only, or as a turnkey solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity. For more information regarding an adapter to meet specific needs, consult the Aries factory.