Synopsys announces production-ready Lynx design system optimised for common platform 28 nm HKMG technology

Microelectronics International

ISSN: 1356-5362

Article publication date: 10 May 2011

61

Citation

(2011), "Synopsys announces production-ready Lynx design system optimised for common platform 28 nm HKMG technology", Microelectronics International, Vol. 28 No. 2. https://doi.org/10.1108/mi.2011.21828bad.004

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited


Synopsys announces production-ready Lynx design system optimised for common platform 28 nm HKMG technology

Article Type: New products From: Microelectronics International, Volume 28, Issue 2

Synopsys, Inc. is delivering a low power, high-performance SoC design solution optimised for the common platform alliance (CPA) 28 nm HKMG technology. Based on Synopsys’ Lynx Design System and its Galaxy(tm) Implementation Platform-enabled flow with Synopsys DesignWare(r) Interface IP, this solution was built through a multi-year collaboration with ARM(r) and the CPA (IBM, Samsung Electronics, Co., Ltd, GLOBALFOUNDRIES). This 28 nm design solution is pre-validated with ARM Artisan(tm) Physical IP and the ARM Cortex(tm)-A9 processor and leverages the latest innovations in material science, mobile multimedia implementation and SoC design practices to lower risk and total development costs of designing the next generation of smart mobile devices.

The production-ready Lynx Design System provides design teams with a comprehensive design environment, including:

  • An open, advanced production flow based on the Synopsys Galaxy™ Implementation Platform.

  • A Foundry-Ready System technology plug-in pre-validated for CPA 28 nm HKMG technology to accelerate project start and tape out.

  • Advanced visualisation capabilities for managing chip design that enable easy flow configuration and execution, as well as on-demand project metrics.

The Lynx Design System takes full advantage of the latest galaxy enhancements, including:

  • Low-power implementation flow including concurrent multi-corner, multi-mode optimisation and analysis with support for IEEE 1801 standard.

  • Design Compiler(r) graphical physical guidance to IC Compiler that tightens timing and area correlation for a faster, predictable and convergent path from RTL to GDSII.

  • IC Compiler Zroute DFM-optimised router and In-Design DRC auto fixing with IC Validator, dynamic rail analysis with PrimeRail and final stage leakage reduction that preserves timing.

The Foundry-Ready System technology plug-in for CPA 28 nm technology provides:

  • Scripts, templates and documentation based on Lynx’s pre-validated production design flow, using 28 nm HKMG foundry technology files and ARM Artisan standard cell logic and memory physical IP, to expedite project setup and design start.

  • Baseline process-specific methodologies, representative settings, design checks and guidelines that speed design closure and tape-out to CPA foundries.

The ARM Artisan(tm) Physical IP platform for the Common Platform CPA 28 nm technology process provides the fundamental building blocks to implement high-performance, low-power SoCs. ARM’s silicon proven IP platform offers a comprehensive set of memory compilers, standard cells/logic and general purpose IO products that meet the most demanding performance and power requirements of the mobile communication and computing markets.

The Lynx Design System also provides an environment for full SoC integration of processors, peripherals and interface IP, including:

  • High-performance, low-power optimised implementation for the ARM Cortex-A9 MPCore(tm) processor. This multicore processor delivers increased performance, scalability and increased control over power consumption for high-performance networking, auto-infotainment, mobile and consumer applications.

  • Synopsys DesignWare interface IP, including the USB 2.0 On-the-Go, HDMI 1.4 and DDR 3/2 PHYs for CPA 28 nm LP technology. These PHYs are optimised for area and low power, and designed to compensate for process, voltage and temperature variations, targeting mobile and consumer applications.

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