TY - JOUR AB - VL - 27 IS - 1 SN - 1356-5362 DO - 10.1108/mi.2010.21827aad.011 UR - https://doi.org/10.1108/mi.2010.21827aad.011 PY - 2010 Y1 - 2010/01/01 TI - Unique sensor film minimizes defects and improves quality in wafer bonding T2 - Microelectronics International PB - Emerald Group Publishing Limited Y2 - 2024/03/29 ER -