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New global consortium for developing microelectronics with enhanced reliability
Article Type: Industry news From: Microelectronics International, Volume 27, Issue 1
Accurately predict failure phenomena by coupling atomic to macroscopic levels
A consortium of leading companies in microelectronics has announced a European initiative to improve the efficiency of engineering reliable electronic components as miniaturization reaches the nanoscale. The project, called NanoInterface (see www.nanointerface.eu), won funding under the Seventh Framework Program for Research and Technological Development (FP7) of the EU (NMP3-SL-2008-214371) in the nanosciences, nanotechnologies, materials, and new production technologies program.
A number of scientific, technological, and societal advances are expected, including the development of a multi-scale approach, a shorter time-to-market and fewer redesign cycles for microelectronic materials, contributions towards the “zero-defect” objectives of the industry and facilitate the implementation of environmentally friendly materials.
In this multi-scale approach, models at atomic level will be explicitly coupled to state-of-the-art macroscopic (finite element) models. In this “bottom-up” approach, a user-friendly software tool will be realized which incorporates chemical, physical, and mechanical information from the atomic level directly into the macroscopic models thereby enabling computational design towards highly reliable metal-oxide-polymer systems for so-called system in package products: complex micro- and nano-electronic systems with applications in various industries, such as microelectronics, health, and transportation.
The consortium is led by Philips Applied Technologies and also comprises the following members:
Centre National de la Recherche Scientifique.
Delft University of Technology.
Georgia Institute of Technology.
Infineon Technologies AG.
St Petersburg Electrotechnical University.
For further information, please visit the web site: www.nanointerface.eu