Half-size SBC packs a full size punch

Microelectronics International

ISSN: 1356-5362

Article publication date: 31 July 2009



(2009), "Half-size SBC packs a full size punch", Microelectronics International, Vol. 26 No. 3. https://doi.org/10.1108/mi.2009.21826cad.003



Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited

Half-size SBC packs a full size punch

Article Type: New products From: Microelectronics International, Volume 26, Issue 3

The powerful new HS-771 SBC from BVM is a half size (185×122 mm) PCI card form factor unit that is ideal for embedded applications where physical space is at a premium. Despite its compact size, the SBC supports Socket P pin-out processors such as the Intel Core 2 Duo Mobile Penryn or Core 2 Extreme with a FSB up to 1,066 MHz addressing up to 4 GB of RAM. The Mobile GM45 Express chipset provides excellent flexibility and performance for developers of embedded applications such as network appliances, gaming platforms and industrial automation equipment, with outstanding graphics, memory and input/output (I/O) bandwidth, asset management capabilities, storage speed and reliability.

The integrated Mobile Intel Graphics Accelerator 4500MHD and Intel Clear Video Technology with graphics core speeds up to 533 MHz provide enhanced graphics and three-dimension rendering performance and enable high-definition video playback; the unit supports numerous display types including VGA, DVI, LVDS, and HDTV. The integrated audio interface is powered by the ICHM-9 chipset.

Extensive internal and external I/O capability is provided: four×300–MB/s SATA interfaces, two×Gigabit LAN ports, eight×USB 2.0 ports, one RS232 and one RS485 ports, a Mini-PCI and a PCI Express Mini card socket. System management functions include an eight-bit GPIO programmable interface and a 256-level watchdog timer.

For further information, please visit the web site: www.bvmltd.co.uk

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