(2007), "Cabot Microelectronics announces a major breakthrough in tungsten CMP technology with WIN CMP slurries", Microelectronics International, Vol. 24 No. 3. https://doi.org/10.1108/mi.2007.21824cad.001Download as .RIS
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Copyright © 2007, Emerald Group Publishing Limited
Cabot Microelectronics announces a major breakthrough in tungsten CMP technology with WIN CMP slurries
Cabot Microelectronics announces a major breakthrough in tungsten CMP technology with WIN™ CMP slurries
Cabot Microelectronics Corporation has announced a major breakthrough in its CMP technology with the WINe platform of tungsten CMP slurries for advanced technology nodes.
The WIN™ platform of CMP slurries was a winner of the 2006 “Best Innovative Product” award at SEMICON West 2006. The WINe product line is the result of extensive research and development by Cabot Microelectronics intended to deliver best-in-class performance at advanced technology nodes with ease-of-use, cleanliness and flexibility to various integration schemes. The WIN™ product line is being successfully used in high volume manufacturing by numerous integrated circuit manufacturers for advanced tungsten CMP processes.
Cabot Microelectronics' WIN™ product line is non-hazardous and environmentally friendly as it is based on hydrogen peroxide technology. The product platform is composed of two main product classes: WIN™ W7000 and WIN™ W7300.
WIN™ W7000 is a high selectivity slurry that builds on Cabot Microelectronics' industry leading Semi-Sperse® W2000 platform. WIN™ W7000 includes fumed silica abrasives and a proprietary etch inhibitor technology that provides best-in- class planarization performance with a wide over-polish window and substantially reduced edge-over-erosion.
WIN™ W7300 is a tunable selective slurry made with an ultra-pure colloidal particle that results in excellent planarization, edge-over-erosion and defectivity performance. WINe W7300 chemistry is compatible with other Cabot Microelectronic tungsten slurries. Additionally, WIN™ W7300 has been used very successfully as a “buff” on a hard pad using the same platen.