New IC wafer fault elimination system

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 January 2006

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Keywords

Citation

(2006), "New IC wafer fault elimination system", Microelectronics International, Vol. 23 No. 1. https://doi.org/10.1108/mi.2006.21823aad.004

Publisher

:

Emerald Group Publishing Limited

Copyright © 2006, Emerald Group Publishing Limited


New IC wafer fault elimination system

New IC wafer fault elimination system

Keywords: Inspection

Envisage Systems the makers of the CAPVIS visual inspection system, have launched a new, low cost wafer inspection system, which enables electronic component manufacturers producing ceramic or silicon wafers to automatically inspect each wafer optically for faults. Typical defects such as broken or breached tracks, scratches, extra material or contamination can be detected, without human intervention and to repeatable exacting company standards. The system is available with or without an integrated faulty chip destruction laser. The complete system including laser will typically cost in the region of $87,000 or 55,000 without the laser.

An operator places each wafer onto an XY inspection table, which is then moved under a high-resolution camera. The camera moves from component to component, building up a map, in memory, of any faulty components. When the inspection is complete, the wafer moves to the destruction position under the laser, which fires a series of tiny pulses to destroy the faulty components and prevent them from continuing in the production process.

Further details about the wafer fault elimination system are available on Envisage Systems' web site: www.envisagesystems.co.uk; Tel: +44 (0) 1442 877770.

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