TY  - JOUR
AB  - 
VL  - 22
IS  - 3
SN  - 1356-5362
DO  - 10.1108/mi.2005.21822cad.005
UR  - https://doi.org/10.1108/mi.2005.21822cad.005
PY  - 2005
Y1  - 2005/01/01
TI  - Low pressure moulding solution streamlines manufacture and extends scope for automotive sensors
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/25
ER  -