Citation
(2005), "New UV-cure encapsulants from Henkel", Microelectronics International, Vol. 22 No. 2. https://doi.org/10.1108/mi.2005.21822bad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
New UV-cure encapsulants from Henkel
New UV-cure encapsulants from Henkel
The electronics group of Henkel has announced the launch of three new UV- cure encapsulants for use in Smart Card IC module manufacturing. The dam- and-fill products are to be marketed under Henkel's Hysol brand and are named Hysol 3323, Hysol 3327 and Hysol 3329 (see Plate 2). Developed using the latest single-component epoxy technology, these encapsulants provide faster curing times, improved adhesion, minimised tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal- cure encapsulants.
Plate 2
Hysol 3329
All three products are designed specifically for the encapsulation of wire-bonded dies used in Smart Card ICs. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are both low viscosity materials used for the fill process. The physical and chemical properties of the three materials have been closely matched, such that Hysol 3323 dam encapsulant is intended for use only with Hysol 3327 or Hysol 3329 fill encapsulants. Hysol 3329 has a higher glass transition temperature (Tg) of 155°C (compared to 110°C for Hysol 3327) and a higher Shore hardness. Either combination will pass mechanical stress testing and high- reliability tests, typically from -55 to +125°C temperature cycling and heat/ humidity ageing at 85°C and 85 percent relative humidity.
These encapsulants provide many benefits during the manufacture of Smart Card IC modules. They are easy to dispense, adhere strongly to a wide range of commonly-used carrier substrates, for example glass epoxy, and possess a low coefficient of thermal expansion (45ppm below Tg and 130ppm above Tg). Typical UV cure times per IC module are between 26-46s, which enables a maximum of 10,000 UPH, with no post-cure requirement. With the combination of higher process throughput achieved, a long pot life that minimises wastage, and competitive pricing, the potential exists for considerable cost- savings.
For further information, visit our web site: www.henkelelectronics.com