Low-cost semiconductor leadframes from fast alternative source

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2005




(2005), "Low-cost semiconductor leadframes from fast alternative source", Microelectronics International, Vol. 22 No. 1. https://doi.org/10.1108/mi.2005.21822aad.007



Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

Low-cost semiconductor leadframes from fast alternative source

Low-cost semiconductor leadframes from fast alternative source

Keywords: Semiconductors

Tecan is now routinely producing high- accuracy bespoke semiconductor leadframes which deliver a range of inherent benefits compared to traditional “stamped” products.

From a single manufacturing facility, encompassing fabrication, forming and finishing, the company produces burr and stress-free leadframes on a rapid turnaround basis – negating the traditional time, price and quality control problems associated with outsourcing.

By exploiting low-cost photo tooling and proprietary photo chemical machining and photo electroforming techniques, the company has become a leader in the provision of prototype, pre-production, low-volume and specialised leadframes.

“Our customer base is expanding in proportion with the increasingly demanding electronics marketplace, where speed and accuracy can not be compromised”, said Shaun Mason, Component Development Manager, Tecan. “We regularly get involved with development work at the leading-edge of design, producing next-generation leadframes which can incorporate any number of customised performance characteristics. Speed and accuracy go hand-in-hand with flexibility and cost- efficiency – for both standard parts and niche application requirements”.

As significantly inexpensive alternatives to stamped parts, Tecan leadframes can accommodate ultra-fine pitch designs with no cost premium, catering for today's increasingly complex and high-pin-count devices. Typical tolerances and feature sizes can be as low as ±2 µm. Unique characteristics, such as post-process rounded leads for hermetic sealing, can also be readily incorporated. In- house plating is also available with options such as electroless nickel, hard acid gold and pure soft gold.

From initial design drawings, low-cost tooling is created to speedily produce prototypes. Down-the-line design modifications are equally cost-effective and rapid – allowing specifiers and designers to bring optimised designs to market on time and to budget.

For more information, visit the Web site: www.tecan.co.uk

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