TY  - JOUR
AB  - 
VL  - 21
IS  - 3
SN  - 1356-5362
DO  - 10.1108/mi.2004.21821cad.007
UR  - https://doi.org/10.1108/mi.2004.21821cad.007
PY  - 2004
Y1  - 2004/01/01
TI  - Inseto introduce TPTs – new low cost wire bonders
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/26
ER  -