Inseto introduce TPTs – new low cost wire bonders

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2004

Keywords

Citation

(2004), "Inseto introduce TPTs – new low cost wire bonders", Microelectronics International, Vol. 21 No. 3. https://doi.org/10.1108/mi.2004.21821cad.007

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Inseto introduce TPTs – new low cost wire bonders

Inseto introduce TPTs – new low cost wire bonders

Keywords: Wires, Bonding, Assembly

The Microelectronic Equipment Division of Inseto has introduced TPTs new low cost HB10 semi- automatic wire bonder in the UK and Ireland (Plate 4).

Plate 4 The HB10 semi-automatic wire bonder from Inseto

Insetos Microelectronic Equipment Division provides equipment that is used for the assembly of microelectronic, microwave or photonic devices. Application areas include automotive, aerospace, military, telecommunications, microwave, fibre-optic and smart-card industries.

The new bonder forms part of TPTs HB series of wire bonders, which include the higher specification HB12 Wedge Bonder, the HB14 Ball Bonder and the HB16 Ball and Wedge Bonder.

The HB10 is designed to offer many features only found in higher specification models, but at a much lower price, including motorized Z motion and touch-down sensing, programmable bonding parameters, program storage, automatic wire feed and simple conversion between ball and wedge bonding.

Inseto has introduced a new low cost wire bonder from TPT of Germany. The bonder, configured for ball and wedge bonding, is suitable for low through medium volume production of microelectronic, microwave or photonic devices.

The HB10 is designed to offer many features only found in higher specification models, but at a much lower price, including motorized Z motion and touch-down sensing, programmable bonding parameters, program storage and automatic wire feed.

For applications requiring both ball and wedge bonding, the bonder can be interchanged from one technology to the other, without changing any hardware. This is achieved by simply changing the bonding tool and selecting the appropriate bonding mode in the systems software.

A wire feed angle of 90°, provides the system with a deep-access bonding capability for 17 through 75 micron wire diameters, or ribbon bonding of up to 25 × 250 microns.

For ease of use, an LCD display is used to access the simple menu system for adjusting parameter settings, machine configuration or for program selection.

For further information, please visit the Web site: www.tpt.de