New DYMAX non-yellowing LED encapsulants

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2004

Keywords

Citation

(2004), "New DYMAX non-yellowing LED encapsulants", Microelectronics International, Vol. 21 No. 3. https://doi.org/10.1108/mi.2004.21821cad.005

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


New DYMAX non-yellowing LED encapsulants

New DYMAX non-yellowing LED encapsulants

Keywords: Encapsulants, Intertronics

Four new acrylate encapsulating resins, designed for brighter chip-on-board LED assemblies, are featured in a new DYMAX selector guide available from INTERTRONICS. When cured with a DYMAX 2000-PC moderate intensity flood curing system, Light-CapTM 9614, 9615, 9616 and 9617 offer superior optical transmission for the life of the assembly. Their resistance to elevated operating temperatures results in reduced yellowing over the life of the LED compared with traditional encapsulating resins. The selector guide includes tests illustrating resistance to heat aging and yellowing over time, along with product properties and typical applications.

The resins contain cure mechanisms more sensitive to the spectral output of both visible and UV curing wavelengths, resulting in deeper, faster cures. Fast cures in 30-45 s with the DYMAX 2000-PC curing system eliminate bottlenecks. This cost-effective system is available in multiple configurations and can be utilised with conveyorised or rotary indexing production lines. Integrated curing chambers are available to accommodate the most basic or sophisticated assembly requirements.

Besides curing completely in only a few seconds, these UV/visible light curing coatings offer a wide range of high performance properties including lower stress on wire bonds, superior adhesion, multiple viscosities, minimal shrinkage and low outgassing. Other characteristics described include good moisture resistance, optical clarity and excellent environmental resistance.

DYMAX Light-Cap coatings and encapsulants form strong, solvent-free bonds to an expanded array of plastic and other substrates including UV absorbing clear or tinted grades of glass and plastics and semi-transparent materials such as FR-4 circuit boards and white ceramics.

INTERTRONICS supplies a complete line of complementary curing and dispensing systems as part of its adhere solutions range.

For further information, please visit the Web site: www.intertronics.co.uk