Keywords
Citation
(2004), "New liquid crystal polymer reduces semiconductor packaging costs", Microelectronics International, Vol. 21 No. 2. https://doi.org/10.1108/mi.2004.21821bad.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2004, Emerald Group Publishing Limited
New liquid crystal polymer reduces semiconductor packaging costs
New liquid crystal polymer reduces semiconductor packaging costs
Keywords: Liquid crystal polymers, Semiconductors
Quantum Leap Packaging has announced a revolutionary breakthrough in semiconductor packaging technology (Plate 3). Utilising a new family of liquid crystal polymers (LCP), developed by Quantum Leap Packaging, it is now possible to produce hermetic plastic packages. Independent testing based on JEDEC and MIL specs confirms that this specially formulated LCP meets the current and future performance requirements for packaging semiconductor devices. By combining this new LCP material with our proprietary moulding process, Quantum Leap Packaging is able to produce air cavity, RF power and optical packages that set a new standard in the ever demanding cost-to-performance ratio.
Plate 3
Quantum Leap Packaging offers industry standard packages for use in telecom,
medical, military and automotive markets
These packages offer the unique capability to control both degree and direction of the coefficient of thermal expansion (CTE) ensuring mechanical stability. Further, the CTE can be tailored to match more efficient heat sink alloys, so users can expect a significant improvement in heat dissipation improving the MTTF of their devices.
There is no need to sacrifice performance or cost. Air cavity packages moulded with this unique LCP represent an ideal, cost- effective replacement to the more expensive conventional technologies such as ceramic or metal and a higher performance alternative to conventional plastic. Quantum Leap Packaging offers industry standard packages for use in telecom, medical, military and automotive markets and will design and manufacture custom packages to meet the performance requirements of unique applications.
For more information, contact: Tel: 978.253- 6112.