WBI-FOX X-ray inspection system selected "Best in Test"

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2004

Keywords

Citation

(2004), "WBI-FOX X-ray inspection system selected "Best in Test"", Microelectronics International, Vol. 21 No. 2. https://doi.org/10.1108/mi.2004.21821bab.009

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


WBI-FOX X-ray inspection system selected "Best in Test"

WBI-FOX X-ray inspection system selected "Best in Test"

Keywords: X-rays, Inspection

The FEINFOCUS WBI-FOX X-ray inspection system has been selected as one of the 2004 "Best in Test" award winners by Test & Measurement World. Each year, technical editors from Test & Measurement World bestow the coveted award on 12 newly introduced inspection products they feel are "particularly innovative or useful," according to the publication.

The WBI-FOX is one of the industry's first precision X-ray inspection systems designed for specific needs of the wafer manufacturing industry. The new system, based on the company's popular FOX series, addresses a recent industry challenge in wafer manufacturing: void detection in wafer bumps.

"As the pioneers in X-ray inspection, I am pleased to accept this award on behalf of everyone at FEINFOCUS," responded Lance Scott, President of FEINFOCUS. "Our team is constantly working to identify future market demands in X-ray inspection, and developing systems that fit those needs."

The WBI-FOX has been completely tailored to meet the regulatory automated handling standards for 200 and 300 mm wafer capability, with a customized automated wafer handling system that prevents any human interface with wafers, flexible inspection recipes that adjust to specific wafer characteristics, and summarized inspection results in pre-defined reports.

The fully programmable system offers ergonomic, user-friendly operation with an adjustable console, fully-automated wafer loading and unloading, fully-automated inspection processes, and real-time image processing tailored to defect analysis. The system also features FEINFOCUS True X-ray Intensity (TXI) Control for stable and permanent image quality, an absolute necessity for real-time void inspection.

For more information, visit the Web site: www.feinfocus.com