TY  - JOUR
AB  - 
VL  - 21
IS  - 1
SN  - 1356-5362
DO  - 10.1108/mi.2004.21821aad.002
UR  - https://doi.org/10.1108/mi.2004.21821aad.002
PY  - 2004
Y1  - 2004/01/01
TI  - The hottest thing in rheology
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/05/13
ER  -