ATEK Technology brings cool solutions to hot applications

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2003

56

Keywords

Citation

(2003), "ATEK Technology brings cool solutions to hot applications", Microelectronics International, Vol. 20 No. 3. https://doi.org/10.1108/mi.2003.21820cad.006

Publisher

:

Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


ATEK Technology brings cool solutions to hot applications

ATEK Technology brings cool solutions to hot applications

Keywords: Thermal testing, Metals, Ceramics

Engineered to provide a solution for thermal management and structural problems in severe environments, the IXION range of thermal materials from ATEK Technology combine the best properties of both metals and ceramics. Enabling the final product to be tailored to meet multiple performance requirements including thermal expansion, weight, stiffness and thermal conductivity, without the compromises often associated with traditional material solutions, they are ideal for use in aerospace, avionic, defence, power, traction, telecommunication, PCB, automotive and high-end commercial applications.

Two product types have been designed for systems requiring low to moderate thermal dissipation through direct-contact conduction cooling and systems requiring high-thermal dissipation through active air or liquid cooling.

For more information, visit our Web site: www.atektechnology.com

Related articles