First in series of NPL Lead-Free Master Classes is well received

Citation

(2003), "First in series of NPL Lead-Free Master Classes is well received", Microelectronics International, Vol. 20 No. 3. https://doi.org/10.1108/mi.2003.21820cac.002

First in series of NPL Lead-Free Master Classes is well received

First in series of NPL Lead-Free Master Classes is well received

Keywords: NPL, Lead-free soldering

A series of Lead-Free Technology Master Classes was recently announced to meet the specific needs of key personnel, i.e. separate classes for management, designers, process engineers and procurement. Initial dates announced included venues around the country and the launch was at the NPL Teddington facility.

The first event proved very successful, it prompted many questions and discussion points raised on a whole host of lead-free issues. Much of the structure of the class allowed interaction. PCB solder finishes and the compatibility of components were the main issues discussed. With the growing trend by OEM's towards EMS providers, outsourcing was also a concern. Many delegates felt that the small and medium sub- contractors have done very little preparation for the changeover to lead-free and cannot answer the questions from customers concerned about the introduction of legislation in 2006.

Concern was also shown by engineers on the compatibility of tin/lead components and lead-free alloys. Through NPL's 10 years of research and practical work on the implementation of lead-free, delegates were provided with an understanding of the effects and limitations of mixing alloys.

The combination of research and practical work provided a valuable insight into the challenges of process and product change. This event was well received and looks set to achieve similar success at venues around the country.