Keywords
Citation
(2003), "IMAPS Nordic", Microelectronics International, Vol. 20 No. 3. https://doi.org/10.1108/mi.2003.21820cab.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
IMAPS Nordic
IMAPS Nordic
IMAPS Nordic annual conference
Keywords: IMAPS
International Microelectronics And Packaging Society Microelectronics Packaging – The Key To The Future!
Venue: Dipoli Congress Centre, Helsinki University of Technology Campus Area, Espoo, Finland
Date: 21-24 September 2003
Provisional hot topics for 2003: 3d packaging, stacked thin dies, outsourcing, ubiquitos computing.
You are kindly invited to take part in this year's annual IMAPS Nordic Conference. Join us for a few days with superb technical presentations from experts from all over the world, outstanding networking, collaboration and communication.
Technical focus and importance
Technical topics for this year's conference are as follows.
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Microvia, HDI laminates;
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Reliability assessment;
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Multilayer ceramics;
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Pb and halogen free electronics, methods and consequences;
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MEMS, MOEMS, sensor integration;
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Very thin and stacked dies, 3D;
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Unique materials, encapsulation, and underfills;
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CSP, flip chips, area array packaging;
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Integrated passives and system in package (SiP);
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High frequency packaging;
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Break-through achievements in the Nordic countries.
Tutorials are to be announced. IMAPS Nordic is known for its high professional quality technical programme.
For further information, visit our Web site: www.imapsnordic.org