TY  - JOUR
AB  - 
VL  - 20
IS  - 2
SN  - 1356-5362
DO  - 10.1108/mi.2003.21820bad.009
UR  - https://doi.org/10.1108/mi.2003.21820bad.009
PY  - 2003
Y1  - 2003/01/01
TI  - SUSS MicroTec introduces new embossing equipment
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/09/19
ER  -