Keywords
Citation
Willis, B. (2003), "Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies", Microelectronics International, Vol. 20 No. 1. https://doi.org/10.1108/mi.2003.21820aae.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Ning-Cheng LeeNewnes270 pp., 12 chapters, illustrations and photographs
Keywords: Reflow, Soldering
It often surprises me how many publishers keep some books a secret. It is often the case that publishers also fail to tell reviewers how much the book costs and provide a biography of the author. However, it is always a great news to hear about one of the industry gurus who has written a textbook. It is even better news when is practical, up to date and very informative. Don’t bother reading the rest of the review, buy the book!
Ning-Cheng Lee has been around the industry for many years working for Indium Corporation of America. I have always liked the style of his presentations and technical articles. They always remind me of lab reports, detail is given on the problem, what was being done to evaluate the problem, the result and the final conclusion. The material is always practical, easy to understand and implement and the book is an ideal example of his work.
The chapters cover each of the major topics traditional surface mount, BGA, CSP and flip chip. There is also space for the obligatory lead-free section. Like any engineer it is nice to find some new fresh material not normally included in a book of this type. Ning-Cheng provides a chapter on underfilling and issues relating to in-circuit test probing which are very practical. Some material suppliers may suggest that as Indium make materials it is a great way of promoting products but that is not the case in the text.
The book is packed with good illustrations and photographs, even a couple of this reviewer’s images have been included on tombstoning. One slightly confusing thing is that some of the photographs and X-rays are not actually photographs but artist impressions. It may be that the true images could not be obtained or permission to include them granted in time for publication. Nevertheless, it does not detract from the value in any way.
Great book, well worth the cost and I look forward to the author signing my copy of the book at APEX, he may be rich and famous one day.
Bob WillisSMART Group