High-performance evaporation masks minimise process costs

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2003




(2003), "High-performance evaporation masks minimise process costs", Microelectronics International, Vol. 20 No. 1. https://doi.org/10.1108/mi.2003.21820aad.007



Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited

High-performance evaporation masks minimise process costs

High-performance evaporation masks minimise process costs

Keywords: Tecan, Cleaning

Tecan has developed high-performance evaporation masks, for use across a wide range of selective vacuum chamber processes, such as the deposition of gold and silver on various substrates (see Plate 4).

Plate 4 Tecan’s evaporation mask

Significantly more durable and accurate than traditional types, the masks represent excellent value for money and will typically withstand the post-deposition cleaning process for up to ten times longer, keeping replacement costs to a minimum. Using electroforming and photo- etching techniques, the company produces tightly coated nickel and magnetic stainless steel masks which out-perform traditional photo-etched molybdenum. The technique combines low tooling costs with superior tolerances, delivering greater density designs with higher accuracy aperture edges.

Multi-level masks can also be produced, with “stepped” recesses, limiting the need for spacer sheets in multiple-sheet sets, if required. Cost-effective single masks, traditional multi-mask sets and stepped masks are available to meet the individual needs of all custom designs.


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