New WLCSP marking system

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2003




(2003), "New WLCSP marking system", Microelectronics International, Vol. 20 No. 1.



Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited

New WLCSP marking system

New WLCSP marking system

Keywords: GSI Lumonics

GSI Lumonics Inc. has announced the release of its new CSP300 wafer-level CSP marking system, which marks WLCSPs and bare die on 300 mm wafers (see Plate 3).

The high throughput, highly accurate CSP300 is fully automated for "in-line" production marking of 200 mm to 300 mm wafers. It provides the marking accuracy required for sub-1 mm integrated circuit sizes regarded as critical to portable electronics, and marks only good die as determined by information downloaded from prober wafer maps. Overall, it allows customers to optimize mark quality and throughput and to assure proper character placement and pin one orientation.

Plate 3 The CSP 300 wafer-level CSP marking system

Other system performance benefits critical to back end production operations include automatic wafer mapping, automatic alignment and calibration, on-board mark inspection and validation, factory networking, clean room compatibility, and both FOUP and SMIF automation interfaces.

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