Keywords
Citation
(2003), "New WLCSP marking system", Microelectronics International, Vol. 20 No. 1. https://doi.org/10.1108/mi.2003.21820aad.006
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
New WLCSP marking system
New WLCSP marking system
Keywords: GSI Lumonics
GSI Lumonics Inc. has announced the release of its new CSP300 wafer-level CSP marking system, which marks WLCSPs and bare die on 300 mm wafers (see Plate 3).
The high throughput, highly accurate CSP300 is fully automated for "in-line" production marking of 200 mm to 300 mm wafers. It provides the marking accuracy required for sub-1 mm integrated circuit sizes regarded as critical to portable electronics, and marks only good die as determined by information downloaded from prober wafer maps. Overall, it allows customers to optimize mark quality and throughput and to assure proper character placement and pin one orientation.
Plate 3
The CSP 300 wafer-level CSP marking system
Other system performance benefits critical to back end production operations include automatic wafer mapping, automatic alignment and calibration, on-board mark inspection and validation, factory networking, clean room compatibility, and both FOUP and SMIF automation interfaces.