High speed heavy wire bonder

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2003




(2003), "High speed heavy wire bonder", Microelectronics International, Vol. 20 No. 1. https://doi.org/10.1108/mi.2003.21820aad.002



Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited

High speed heavy wire bonder

High speed heavy wire bonder

Keywords: Wire bonding

F&K Delvotec has improved its high speed heavy wire bonder 6600 further by offering bonding speeds of less than 500 ms/wire (see Plate 1).

Especially for smart-power hybrids and modules, both components for intelligent control systems, this is an important advantage, as those applications require a large number of wires to be bonded. Thus, speed is the crucial requirement. The 6600, now equipped with “Third Generation Software”, can easily satisfy this demand.

Plate 1 The high speed heavy wire bonder 6600

Till now the standard speed for heavy wire applications was 700-750 ms/wire. In recent tests speeds of less than 400 ms/wire have been reached still offering acceptable bond quality.

But speed is not the only improvement. Quality assurance, which is essential to many customers, has not been neglected either. The bond process control, invented and patented by F&K Delvotec, now also offers integrated impedance measurement.


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