SUSS unveils new AP200SAW

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2003



(2003), "SUSS unveils new AP200SAW", Microelectronics International, Vol. 20 No. 1.



Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited

SUSS unveils new AP200SAW

SUSS unveils new AP200SAW

SUSS has unveiled its new AP200SAW, which provides a wafer test system capable of reliably probing surface acoustic wave (SAW) substrates in a production environment. The new system addresses traditional setbacks of testing SAW- Filters, amplifiers etc., which are generally mounted on brittle wafers covered with extremely thin metal layers down to 50 nm.

The AP200SAW is a combination of a fully automatic prober, offering a broad range of software solutions, including software tailored to the specific SAW requirements. The unparalleled SUSS IZI Probes enable wafer level testing with high accuracy and high throughput without causing damage to sensitive substrates. The result for customers is an effective high volume production solution with high flexibility and low cost of ownership for the test of wafers with diameters up to 200 mm.

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