Hybrid lids fabricated and plated on same site

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2002




(2002), "Hybrid lids fabricated and plated on same site", Microelectronics International, Vol. 19 No. 3. https://doi.org/10.1108/mi.2002.21819cad.003



Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited

Hybrid lids fabricated and plated on same site

Keyword: Tecan

High-accuracy burr and stress-free stepped-lids, essential for sealing semiconductor and optoelectronic hybrid package tubs, are now available from a single source, cutting out the time and quality problems associated with contracting out specialist production elements, such as plating. (see Plate 3).

Plate 3 Tecan provide high-accuracy burr and stress-free stepped lids

Tecan has developed design and manufacturing techniques which ensure manufacturers to access the most sophisticated, technology from its complete-service facility in Weymouth, Dorset.

Believed to be unique, the company's ability to provide all necessary manufacturing techniques under one roof, is critical in ensuring the best possible quality control and repeatable consistency available, for both flat and stepped lids.

Highly-accurate and proven photo-chemical machining techniques are used to manufacture the parts, and tooling costs are low. The process also brings other value-added benefits at no extra cost – for example, part numbers, company contact details and other data can be readily etched onto the lid.

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