ESEC wins large order in Korea

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2002




(2002), "ESEC wins large order in Korea", Microelectronics International, Vol. 19 No. 3.



Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited

ESEC wins large order in Korea

Keywords: Korea, Die bonding

ESEC has announced that it has received an order for 16 of its 2008 Die Bonders from ASE Korea, one of the world's largest independent providers of semiconductor packaging and testing services.

The 16 machines for wireless module applications will be delivered within a few months to ASE Korea's facility in Paju. A senior manager at the Manufacturing Division of ASE noted that the company required a versatile machine and concluded that the Die Bonder 2008 can deliver the highest degree of flexibility.

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