TY  - JOUR
AB  - 
VL  - 19
IS  - 3
SN  - 1356-5362
DO  - 10.1108/mi.2002.21819cab.009
UR  - https://doi.org/10.1108/mi.2002.21819cab.009
PY  - 2002
Y1  - 2002/01/01
TI  - Thermal & mechanical simulation and experiments in micro-electronics and micro-systems
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/09/22
ER  -