2003 Conference on Ceramic Interconnect Technology announced

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2002




(2002), "2003 Conference on Ceramic Interconnect Technology announced", Microelectronics International, Vol. 19 No. 3. https://doi.org/10.1108/mi.2002.21819cab.008



Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited

2003 Conference on Ceramic Interconnect Technology announced

Keywords: IMAPS, Ceramics interconnectic

IMAPS, The Ceramic Interconnect Initiative and the American Ceramic Society are pleased to announce the 2003 Conference on Ceramic Interconnect Technology, to be held at the Westin Hotel, Denver, Colorado, USA, April 8-9, 2003.

This Conference will identify and address key issues in packaging in ceramic interconnect technology, which is finding wide application in many new and rapidly growing microwave wireless and photonics applications. This workshop will cover the most recent advancements in ceramic interconnect technology materials and process for these applications, essential in reducing time to market, reducing costs, and wide-scale deployment of these rapidly growing technologies.

Papers are invited for proposed session on the following topics; abstracts are due by November 15, 2002, and can be submitted online at www.imaps.org:

  • Portable wireless applications and Bluetooth

  • Base stations

  • Broadband and mm wave

  • Military applications

  • Fiber Optic and Electro-Optic applications

  • Automotive Applications

  • MEMS Applications

  • Materials

  • Integrated Passives

  • Design, modeling and simulation

  • Testing

  • Thermal Properties

  • Assembly

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