(2002), "IMAPS ceramic workshop paves way for ceramic interconnect technology conference in 2003", Microelectronics International, Vol. 19 No. 3. https://doi.org/10.1108/mi.2002.21819cab.004
Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
IMAPS ceramic workshop paves way for ceramic interconnect technology conference in 2003
Keywords: IMAPS, Ceramics
Success is the consensus among planners and attendees following the recent IMAPS advanced Technology Workshop (ATW) on Ceramic Applications for Microwave and Photonic Packaging in Providence, R.I. – so much so that an expanded conference is planned for next year. International experts representing materials developers, circuit manufacturers, equipment suppliers and OEMs met at the ATW, which kicked off with an outstanding keynote address by Dr David L. Wilcox of Motorola Labs, in which he presented a vision of multilayer ceramic technology as the foundation for development of a broad range of microsystems technologies.
Presentations described advances across a range of topics including design, power and thermal Management, RF & Wireless, Broadband and Photonics, LTCC, Materials and Test and Measurement. Presenters were from the US, UK, Germany, France, Finland and Taiwan.
Following the success of this there will be a Conference on Ceramic Interconnect Technology, held at the Westin Hotel, Denver, Colorado, USA, April 8–9, 2003.
This Conference will identify and address key issues in packaging in ceramic interconnect technology, which is finding wide application in many new and rapidly growing microwave wireless and photonics applications. This workshop will cover the most recent advancements in ceramic interconnect technology materials and process for these applications, essential in reducing time to market, reducing costs, and wide-scale deployment of these rapidly growing technologies.
Papers are invited for proposed sessions on related topics; abstracts are due by November 15, 2002.