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Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
EMPC 2003 invites abstracts of unpublished work
Keywords: IMAPS, Microelectronics, Packaging
The Technical Program Committee of EMPC 2003 invites abstracts of unpublished work describing recent developments in Micro- electronics and Packaging.
Topics include, but are not limited to:
Materials and Technologies(Thick/Thin film, LTCC, Advanced PCBs, MCMs, FlipChip, CSP, COB, SMT)
Design and Modelling(DFM, thermal/electrical/mechanical simulations, CAD tools)
Manufacturing and Processes (HDI Processing, Large Area Processing)
Applications(RF/Microwave, Power Packaging, Photonic Packaging, Automotive, Avionics, Advanced Packages, Medical)
Quality and Reliability(Test and Inspection techniques, 1st/2nd level package reliability, qualification standards)
Environment(Green materials, Lead free products, Product Recycling, Waste Recycling)
The 200-300 word abstract should clearly summarize the scope, technical content, novelty and results of the proposed contribution. It should include the title of the presentation, keywords, the name(s) of the author(s), their affiliation and company address (including E-mail, phone and fax).
The name of the presenting author should be underlined. Please indicate also the main topic (from the list above) and if you prefer to submit for a poster display presentation.
Please E-mail your abstract in Word or an equivalent format to: email@example.com