(2002), "Note from the publisher", Microelectronics International, Vol. 19 No. 3. https://doi.org/10.1108/mi.2002.21819caa.003
Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Note from the publisher
Throughout 2003 Microelectronics International will continue to provide a central, authoritative and Independent forum for the exchange of information pertaining to the research, development and application of technologies associated with the design, manufacture and assembly of miniaturised devices and advanced packages. Through plans to establish an Editorial Advisory Board throughout next year, the Editor and Publisher are confident that Microelectronics International will continue to deliver high quality, cutting edge papers.
If you have a paper that you would like to be considered for publication in Microelectronics International, then please contact John Atkinson at firstname.lastname@example.org John will be pleased to hear from you if you have a state of the art technical paper, a research paper, a case study or a review article that you would like publishing.
As an author, you can be sure that your work will be widely disseminated due to the international exposure to leading industrial and academic institutions via the Emerald database and distribution to the members of many European IMAPS groups who have adopted Microelectronics International as their official publication.
Electronic usage of Microelectronics International has continued to increase for the period May 2001 to April 2002. During this time the journal had over 14,000 visits to the web site with users in the UK, North America, Australia and the Far East being the most active. The benefits of having an electronic archive are clear to see when we look at the most accessed article for this period. As we can see below, content from over four years ago continues to be regularly accessed alongside more recent content:
Most accessed articles for the period May 2001 to April 2002
Self-managing teams in high technology manufacture: overcoming technological barriers
Volume 16 Issue 1
Measurement techniques for the evaluation of thick-film materials used in wireless applications
Z Tian and C Free
Volume 18 Issue 2
An analysis of technology trends within the electronics industry
P J Palmer and D J Williams
Volume 17 Issue 1
The impact of lead-free soldering on electronics packages
L Yang, J B Bernstein and K Chung
Volume 18 Issue 3
Embedded passive components and PCB size — thermal effects
D M Stubbs, S H Pulko, A J Wilkinson, B Wilson, F Christiaens and K Allaert
Volume 17 Issue 2
Substrate characterization: simulation and measurement at high microwave frequencies
C Free, Z Tian and P Barnwell
Don't forget to use your electronic entitlement as a subscriber to Microelectronics International. Also, tell us about the articles you like, and the subjects you would be interested to see covered in the journal.
Contact Managing Editor, Sharon Parkinson at email@example.com