IMAPS USA

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2002

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Citation

(2002), "IMAPS USA", Microelectronics International, Vol. 19 No. 2. https://doi.org/10.1108/mi.2002.21819bab.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited


IMAPS USA

IMAPS USA

IMAPS Announces 3-Year Strategic Plan

IMAPS announces its Strategic Plan for 2003 – 2005, as presented by Dr. Peter G. Barnwell, President Elect, and approved by the IMAPS Executive Council. (It is customary for IMAPS President Elect to propose a strategic plan in advance of his actual administration; IMAPS' current President is Dr. Charles E. Bauer).

According to Dr. Barnwell, IMAPS' 3-Year Strategic Plan involves three key implementation points, and these include providing the best possible services and facilities to IMAPS members, support of organizational members in achieving their goals, strong financial management, and maintaining and developing international links.

IMAPS' Mission Statement, Dr. Barnwell stated, is that "IMAPS will lead the Microelectronics Packaging, Interconnect and Assembly Industries, providing means of communicating, educating, and interacting at all levels."

Key objectives of the plan include greater interface and support for IMAPS North American chapters, via Regional Directors; continuing to provide enhanced benefits to organizational members; to develop Advanced Technology Workshops and Technology Workshops (ATWs and TWs) and conferences developed from them; and to bring the Certified Microelectronics & Packaging Engineer program to fruition.

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