Keywords
Citation
(2002), "New flip chip underfill offers high compatibility with no-clean fluxes", Microelectronics International, Vol. 19 No. 1. https://doi.org/10.1108/mi.2002.21819aad.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
New flip chip underfill offers high compatibility with no-clean fluxes
Keywords: Flip chips, Flux
Dexter Electronic Materials has introduced new Hysolw FP4549FC, a package level underfill designed to offer excellent adhesion to flip-chip assemblies containing a wide variety of no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at l65°C and meets JEDEC Level-3 260°C requirements.
The new underfill is a high purity, low stress liquid epoxy encapsulant designed for use in fine pitch applications having gaps as small as 25 microns. This "green" material is compatible with no lead assemblies, and offers high adhesion to a variety of substrates including integrated circuit passivation materials, metals, and solder masks. Formulated to perform reliably on semi-rigid and flexible substrates, fully cured it forms a rigid seal that dissipates stress on solder joints and extends thermal cycling performance This product provides extremely fast capillary flow, flowing a half-inch in a 3-mil gap in just 38 seconds.
For more information visit: www.loctite.com/electronics