Citation
(2002), "Pan Pacific Microelectronics Symposium Preliminary Program Announced", Microelectronics International, Vol. 19 No. 1. https://doi.org/10.1108/mi.2002.21819aab.008
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Pan Pacific Microelectronics Symposium Preliminary Program Announced
The Seventh Annual Pan Pacific Microelectronics Symposium (February 5-7, 2002, at the Westin Maui Hotel in Maui, HI) promotes international technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Sponsored by the SMTA, the Pan Pacific Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems and assembly.
The 2002 technical program consists of 15 sessions with 63 papers on topics such as Flip Chip, DCA, Underfills, Eutectic & Lead Free Solder Materials, HDI, High Performance Embedded Passives, Product Management, Thermal Management, Inspection, Emerging Technologies, 3-D Packaging, and a new focus area on MEMS & Optoelectronics.
Also featured during the Pan Pacific Symposium are the Keynote Reception and the Plenary Session. The Keynote Reception will feature Martin Goetz, Alpine Micro, with a presentation entitled ''SoC or SiP? Alternative Paths to HDI (SLI)'', and the Plenary Session will focus on Markets and Business, including a presentation from Samsung on Memory Market.
Speaker for the Symposium come from the United States, Canada, Italy, Belgium, Germany, Poland, Denmark, Japan, Taiwan, Singapore, and Korea.
The program has been arranged by General Chair Iwao Tachikawa, NAMICS, Japan; North American Coordinator Charles E. Bauer, TechLead Corporation, USA; and Technical Program Chair Mahadevan Iyer, IME, Singapore.
Visit smta.org/pan_pac or contact SMTA executive administrator JoAnn Stromberg for more info on SMTA Dallas: 952-920-7682 or joann@smta.org.