Dexter introduces flip chip underfill encapsulant for use in 260°C reflow, no lead applications

Citation

(2001), "Dexter introduces flip chip underfill encapsulant for use in 260°C reflow, no lead applications", Microelectronics International, Vol. 18 No. 3. https://doi.org/10.1108/mi.2001.21818cad.004

Dexter introduces flip chip underfill encapsulant for use in 260°C reflow, no lead applications

Dexter introduces flip chip underfill encapsulant for use in 260°C reflow, no lead applicationsKeywords: Dexter Electronic Materials

Dexter Electronic Materials has introduced HYSOLae FP4549, the only underfill available that is qualified to perform in 260°C reflow applications. FP4549 underfill encapsulant heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 26°C requirements.

FP4549 is a high purity, low stress liquid epoxy encapsulant formulated to quickly underfill gaps as small as 20 microns between the die and the substrate. This "green" material is compatible with no-lead assemblies, and offers high adhesion to a variety of substrates including integrated circuit passivation materials, metals, and solder masks. Formulated to perform reliably on semi-rigid and flexible substrates, fully cured HYSOL FP4549 forms a rigid seal that dissipates stress on solder joints and extends thermal cycling performance. This product provides extremely fast capillary flow, underfilling a one-inch chip in just seconds.

For more information on HYSOLae 4549, call 626 698 6511 or visit the Dexter Web site at www.dexelec.com

Dexter introduces 260°C reflow teflon-filled non-electrically conductive adhesives

Dexter Electronic Materials has introduced new QMI 547, TeflonTM (PTFE)-filled, thermally conductive adhesives used to attach integrated circuits and components to advanced substrates including PBGAs, CSPs, stacked die, and array packages based on flexible tape or organic laminates. QMI 547 is the lowest stress material available for large die or where the substrate's co-efficient of thermal expansion (CTE) differs substantially. This product is qualified to perform in lead-free, 260°C reflow applications.

Thermally conductive, hydrophobic, and stable at high temperatures, QMI 547 delivers void-free bond lines with excellent adhesive strength on a wide variety of organic and metal surfaces including solder mask, BT, FR, polyimide, gold, KaptonTM, and Mylar~. The adhesives also offer excellent dielectric properties.

Designed to achieve UPHs substantially higher than conventional oven cures, QMI 547 is formulated to cure in-line, either on the diebonder using a post-diebond heater or on the wirebonder preheater. OMI 547 can be cured in-line using Skip-Cure~ processing in just eight seconds at I 500C, or using a variety of times and temperatures in conventional ovens or snap cure stations.

For more information on QMI 547, call 626-698-6511 or visit the Dexter Web site at www.dexelec.com