New developments from F&K Delvotec

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2001




(2001), "New developments from F&K Delvotec", Microelectronics International, Vol. 18 No. 3.



Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited

New developments from F&K Delvotec

New developments from F&K DelvotecKeywords: Bonding, F&K Delvotec

High speed, heavy wire bonder model 6600; speed and precision in perfect union

This new, improved heavy wire bonder works over 25 per cent faster, which means significant savings and the highest throughput with unsurpassed quality making the 6600 even more attractive, especially for leadframe applications.

Multi-chip, multi-placement die bonder model 4500 with even more flexibility

The new touch-down sensing, automatic height measurement integrated into the epoxy head allows exact height measurements to be made as often as needed anywhere on the substrate on which die are to be placed – ideal for sensitive, demanding epoxy deposition and subsequent ultra precision die placement.

Furthermore, the machine can now be fitted with three types of dispenser, the new peristalic dispenser being designed for use with more abrasive epoxies.

Ribbon/deep access wedge bonder model 6400

Two unique new capabilities have been added to this model. This model offers the only bond head in the world with an additional integrated wire clamp, bringing numerous advantages. No more limitation on the width or strength of the ribbon to be bonded; ribbon of 125 micron width and more can now be bonded trouble-free. The upper, more powerful clamp serves solely to tear-off the wire or ribbon. The rear clamp is used to give exact control over loop height and length within 5 per cent.

The moving miniature COD camera and LED lighting unit make on-line side-viewing of the loop and tail creation a reality, bringing improved documentation of the loop geometry for even greater quality assurance. The model 6400 with additional capability bond head is ideal for any high frequency application, ensuring we will be at the forefront in ribbon bonding technology.

Pull tester model 5600

This latest product fits smoothly into F&K Delvotec92s portfolio of die and wire bonders and associated equipment. The 5600 is PC controlled and the programmable X/Y table allows automatic measurement of any number of bonds. The test results can be analysed and reported immediately or they can be exported to various databases. Powerful extended capabilities for measuring power/time or power/distance curves deliver more data over the quality of the bonds tested. Exchangeable measurement pods bring the flexibility of different force ranges and additional heads for shear testing are available.

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