Intertronics named UK distributor for Thermoset

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2001




(2001), "Intertronics named UK distributor for Thermoset", Microelectronics International, Vol. 18 No. 3.



Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited

Intertronics named UK distributor for Thermoset

Intertronics named UK distributor for ThermosetKeywords: Intertronics, Thermoset

Thermoset has appointed Intertronics as sole UK distributor for its extensive TM range of CircuitSAF circuit assembly materials.

The range includes surface mount adhesives, thermally conductive materials, die-attach adhesives, glob-top encapsulants, cavity/dam encapsulants, flip chip underfill encapsulants and silver-filled adhesives. It has been designed to give users a family of leading edge, high quality materials designed to increase manufacturing speed, productivity and reliability performance. CircuitSAF materials have been engineered to be compatible with leading edge manufacturing processes and are available in a wide variety of packaging to accommodate advance delivery techniques and equipment. They are manufactured to rigid specifications in controlled world class production facilities.

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