(2001), "IMAPS USA. IMAPS optoelectronics packaging advanced technology workshop program announced", Microelectronics International, Vol. 18 No. 3. https://doi.org/10.1108/mi.2001.21818cab.001
Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
IMAPS USA. IMAPS optoelectronics packaging advanced technology workshop program announced
IMAPS optoelectronics packaging advanced technology workshop program announcedKeywords: IMAPS, USA
IMAPS USA has announced the program details of its upcoming Advanced Technology Workshop (ATW) on Optoelectronics Packaging, to be held 11-14 October 2001 at the Hotel Bethlehem in Bethlehem, Pennsylvania.
The optoelectronics component industry has enjoyed a period of unprecedented growth spurred on by the insatiable desire for higher data rate transmission and increased bandwidth. This ATW will bring together scientists and engineers from industry, academia and government to address the unique technical challenges faced by all in the optoelectronic packaging arena. The workshop begins with a Thursday night kick off and keynote address by John Pittman of Agere Systems. Friday's session addresses the packaging challenges posed by the various device types, e.g. detectors, modulators, amplifiers, MEMS etc. along with their associated packaging processes. Saturday's sessions are all about alignment and automation issues. The evening session will be held across the river on the scenic campus of Lehigh University, where the focus will redirect to attachment and materials issues in opto packages. One of the ATW's highlights will be "The new kids in town". With a multitude of start-ups in the area, attendees will have the opportunity to interact and learn first hand some of the unique packaging issues and challenges facing new start-up companies. Plenty of social time is planned to facilitate informal interaction among attendees. More information, as well as on-line registration, is available at http://www.imaps.org/eventinfo/atw2001opto.htm
Optoelectronics ATW program at-a-glance
Thursday, 11 October
7.15 p.m.-8 p.m. "The rise and fall of the photon", John Pittman, VP of Manufacturing, Agere Systems.
Evening social, open invitation
8.15 p.m.-9 p.m. "New kids in town". Local start-ups and emerging players in the optoelectronics packaging community will be given a few minutes each to introduce themselves and state the major technical challenges in packaging optoelectronic devices.
Friday, 12 October
Optoelectronic devices and packaging challenges. Session chair: Prof. Aicha Elshabini, University of Arkansas 8.30 a.m.-Noon
Optoelectronic packaging and processes Session chair: Dr. Rajeshuni Ramesham, Jet Propulsion Lab/NASA. 3 p.m.-6 p.m.
Evening Social with Poster Session
8.15 p.m.-9 p.m.
Saturday, 13 October
Fiber alignment and attachment session chair: Robert "Hutch" Hutchison, Melles Griot 8.30 a.m.-Noon
Package Assembly and Materials Session chairs: Lee Levine, Agere Systems; Prof. Ray Pearson, Lehigh University 3 p.m.-6 p.m. Session held at Lehigh University Asa Packer Campus
Evening Social with Educators
8.15 p.m.-9 p.m. Student poster competition
An example of papers to be presented include "Waveguide devices, filters, and optical multiplexers: current and future trends" by Prof. Greg Salamo, University of Arkansas; "Large format, broadband and multi-color GaAs/AlGaAs quantum well infrared photodetector (QWIP) focal plane arrays" by Sumith Bandara, Jet Propulsion Lab/NASA; and "AuSn thin film solder layers for assembly of optoelectronic devices" by Georg Greitmann, Hightec MC AG, Switzerland, to name only a few.
For more information, contact the following individuals: General Chair: Thomas Green. Tel: 610 861 4128; E-mail: email@example.com
Technical Chair: Bill Heffner. Tel: 610 939 3854; (610 939 3854); E-mail: firstname.lastname@example.org
Contact IMAPS at 611 2nd Street, NE, Washington, DC 20002, USA. E-mail: IMAPS@imaps.org; Tel: 202 548 4001; Fax: 202 548 6115; Home Page: http://www.imaps.org.