Keywords
Citation
(2001), "New paste die attach adhesive designed for lead-free initiatives", Microelectronics International, Vol. 18 No. 2. https://doi.org/10.1108/mi.2001.21818bad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
New paste die attach adhesive designed for lead-free initiatives
New paste die attach adhesive designed for lead-free initiatives
Keywords Ablestik, Adhesives, Lead-free, Semiconductors
Ablestik has introduced a new generation of semiconductor packaging adhesives for Pb-free packaging. The ABLEBOND 2000 series electrically conductive die attach adhesives are designed specifically for Plastic Ball Grid Array (PBGA) packaging and matrix style BGA designs. These materials can withstand higher temperature re-flow for lead-free electronic assembly due to very low moisture absorption and optimized adhesion and stress. Engineered with a low modulus, these materials are suitable for a wide range of die sizes, up to 500 x 500 mil square.
In addition, the ABLEBOND 2000 series adhesives exhibit very low bleed on solder mask surfaces, a critical requirement for fine pitch BGA applications. The 2000 series is designed for manufacturability, offering excellent dispensing characteristics and fast cure capability.
Further details: Tel: +1 (310) 764 4600; Fax +1 (310) 764 2545; Internet: www.ablestik.com