New Z motion control design permits precisely controlled die bond loads

Citation

(2001), "New Z motion control design permits precisely controlled die bond loads", Microelectronics International, Vol. 18 No. 2. https://doi.org/10.1108/mi.2001.21818bad.003

New Z motion control design permits precisely controlled die bond loads

New Z motion control design permits precisely controlled die bond loads

Keywords Semiconductor Equipment, Die bonding

Semiconductor Equipment Corporation has also announced that it has perfected a design for Z motion control on its semiautomatic Model 410 flip chip bonder and Model 860 Omni bonder that makes possible precisely controlled, repeatable die bond loads over a range as low as 5 grams and up to as much as 10 kilograms.

The new SEC proprietary Z motion control design for the placement tool on the bonders accommodates all solder, epoxy and adhesive applications, including those requiring different bond loads at each point in the bonding cycle, e.g. one load at pick-up, another at flux dip and another at placement.

The placement tool's stable Z movement and subsequent uniform application of bond load is achieved through the use of an extremely accurate load cell sensing system that is housed in a super rigid drive train. The new design permits initial travel of the head downward at rapid speed to a certain elevation above the target site, at which point electronic sensing guards against premature activation of the bond load.

According to SEC, the new Z motion control feature simplifies process set up, particularly when a dual tool head is used for picking up a die and pre-forms with different heights. The operator simply sets the pick-up heights for the tool head based on the elevations that are sensed. According to the company, all of its Model 410 and 860 systems are now being shipped with the new precision servo motor-driven Z motion feature.