Keywords
Citation
(2001), "New automatic ribbon bonder offers industry's fastest wire cycles", Microelectronics International, Vol. 18 No. 2. https://doi.org/10.1108/mi.2001.21818bad.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
New automatic ribbon bonder offers industry's fastest wire cycles
New automatic ribbon bonder offers industry's fastest wire cycles
Keywords Kulicke and Soffa, Bonding
The K&S Triton wedge bonder platform shown for the first time at Semicon Europa is built around Kulicke & Soffa's industry leading technology and will further advance wedge bonding capabilities. The first member of this new family of products is the K&S Triton RDA Ribbon Deep Access Bonder, an automatic wedge bonder designed specifically for ribbon bonding. The Triton RDA combines the industry's fastest cycle speeds (twice that of the nearest competitor for 1 mil high x 10 mil thick wires) with deep access capabilities and a fully automatic material handling system.
The new ribbon bonder is designed to provide ribbon wire's superior bond characteristics and electrical performance for devices used in the rapidly growing wireless product market, and in telecommunications, opto-electronics, power electronics, defense, and computer peripherals applications. There currently is no high-accuracy, high-performance bonder serving this market, which is quickly moving from manual to high-volume, fully automatic production.
The K&S Triton RDA has one inch of bondhead Z stroke and deep access, 90 degree wire feed angle that enable bonding of packages with deep cavities and large downsets. In addition, the combination of wedge bonding technology, exceptional looping control, and ribbon wire can provide significant performance and reliability advantages.
Further information is available from: www.kns.com