IMAPS Nordic 38th Annual Conference

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2001

33

Citation

(2001), "IMAPS Nordic 38th Annual Conference", Microelectronics International, Vol. 18 No. 2. https://doi.org/10.1108/mi.2001.21818bab.002

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


IMAPS Nordic 38th Annual Conference

IMAPS Nordic

IMAPS Nordic 38th Annual Conference

The 38th Annual Conference is to be held at the Olavsgaard Hotel, Oslo, Norway, 23-26 September 2001.

Proposed topics include:

  • Microelectronics applications.Trends in telecommunications.Ceramics for future electronics.Unique materials, encapsulation & underfills.Microvia.HDI laminates.CSP.Flip chips.Area array packages.Bare die.MCM and 3D packaging.Future electronics strategies and R&D.Reliability assessment.Advanced interconnect.Integrated passives and SiP.System cost assessment.Pb and halogen free electronics.Assessing environmental impact.MEMS.Micro electro mechanical systems.Break-through achievements in the Nordic Countries.Manufacturing processes.High frequency packaging.

Further details: http://www.imapsnordic.a.se; Email: ; or the Exhibition Host: exhib@imapsnordic.a.se

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