Bonder attachment for reworking underfilled flip chips

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2001

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Keywords

Citation

(2001), "Bonder attachment for reworking underfilled flip chips", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aad.015

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


Bonder attachment for reworking underfilled flip chips

Bonder attachment for reworking underfilled flip chips

Keywords: SEC, Rework, Underfill

Semiconductor Equipment Corporation (SEC) has announced the completion of development and commercial availability of an attachment option for reworking underfilled flip chips on the company's low cost standard semi-automatic Model 850 flip chip bonder (Plate 7).

Plate 7 SEC's new combination Model 850/870 flip chip bonding and rework platform

The availability of the new Model 870 attachment for removing flip chips that have been bonded using the new reworkable underfill materials (made by such manufacturers as Loctite, Emerson & Cuming and IBM) successfully culminates a year-long development effort at SEC during which time the company worked closely with the underfill manufacturers. The new rework add-on to the Model 850 bonder is particularly suited for those flip chip processes involving the new reworkable single-step combination underfill/flux materials, including the new no-flow reworkable underfills.

The attachment option includes a focused chip heat source for spot heating the chip to melt the solder and break down the underfill; a heated stage with substrate holder for holding the substrate flat and for evenly heating the bottom side of the substrate to prevent thermal shock and distortion; a chip grabber for pulling/shearing off the chip; a microscope with illuminator for alignment; a control box with a power supply; and provision for site clean-up. An external computer can be used to display thermal profiles and upload them to the Model 870's temperature controller. The profile recipes can be configured and stored from the PC by name and number. Capability includes programmable display of the measured variable, setpoint and parameter being edited, number of cycles or time remaining, as well as whether the cycle is in ramp or soak. The same final cycling used during initial reflow of the flip chip via an oven can be reproduced.

Further details: Lester Salvatierra. Tel: +1 805 529 2293; Fax: +1 805 529 2193; E-mail: seclester@aol.com; Internet: http://www.semicorp.com

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