Loctite introduces dam and fill products for encapsulation applications

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2001

152

Keywords

Citation

(2001), "Loctite introduces dam and fill products for encapsulation applications", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aad.004

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


Loctite introduces dam and fill products for encapsulation applications

Loctite introduces dam and fill products for encapsulation applications

Keywords: Loctite, Encapsulation

Loctite Corporation has introduced two new products for chip-on-board encapsulation applications. These high purity liquid epoxies are designed to work together as dam and fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mechanical damage, corrosion, and electrical interference.

Loctite® 3532 (Plate 3) is a high viscosity material that provides minimum flow, allowing the epoxy to act as a dam or flow control barrier around areas of bare chip encapsulation. Loctite® 3533 is a low-viscosity, self-leveling fill material that flows easily, effectively penetrating and covering fine-pitched wire leads. Although these materials are typically used together in dam and fill applications, Loctite 3533 can be used alone in devices that contain a cavity.

Plate 3 Loctite 3532

Loctite 3532 and 3533 are easy to dispense, minimize induced stresses, provide improved temperature cycling performance, and offer excellent chemical resistance. These products cure to form void-free globs on exposure to heat, with full cure in 30 minutes at 150°. The materials are formulated for low CTE, minimizing stress on wire bonds during thermal cycling.

Further details: http://www.loctite.com

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