Philips Semiconductors has new angle on automotive sensing

Citation

(2001), "Philips Semiconductors has new angle on automotive sensing", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aad.002

Philips Semiconductors has new angle on automotive sensing

Philips Semiconductors has new angle on automotive sensing

Keywords: Philips, Automotive sensors

Philips Semiconductors, a division of Royal Philips Electronics, is developing a programmable angular measurement sensor for use in automotive applications. Listed as the KMA200, the new device is accurate to within 0.6 of a degree. Owing to its robust design, accuracy and inherent safety, it is well suited to automotive applications such as X-by-wire.

The KMA200 is able to use the magneto-resistive (MR) properties of thin film permalloy to sense the angle between an external magnetic field in the plane of the sensor and the sensor itself. By using this technique greater accuracy can be obtained over far greater distances between the moving surfaces than is possible with alternative devices, such as those based on the Hall effect. The new device measures the angle directly, rather than by a derivative means, as in Hall effect products.

Users of the device, which is delivered pre-calibrated, are able to program adjustments to the angular range of the device and re-set its zero point. They can also configure a 32-bit identifier and set the device output to an analog or digital form. The latter is delivered via a Motorola compatible serial peripheral interface (SPI). Settings are stored in an EEPROM.

When operating from a typical supply voltage of 5V the KMA200 consumes 50mW of power. Over-voltage and reversed polarity protection are both incorporated into the device, as is temperature supervision. Online diagnosis features ensure that confidence is retained in the integrity of its output. Input and output signals are constantly monitored and deviations and failures of the angle value are indicated in the output signal. The controller and memory are fully supervised. It is rated for operation at temperatures between –40°C and +125°C.

"The KMA200 is an important piece of the X-by-wire jigsaw," said Andreas Ogrzewalla, International Product Manager at Philips Semiconductors. "It is a significant step toward completing a picture that shows Philips Semiconductors as a dominant global force in automotive electronics, able to deliver a complete range of X-by-wire components to the industry. This component has many applications within the car, is safer and more accurate than alternatives and enables X-by-wire systems to be a reality."

The KMA200 IC will be manufactured in a plastic multi-chip S0T637 five-pin package, which measures approximately 20mm in length. It comprises two components: an MR sensor chip joined to a signal conditioning chip by six interconnects. High volume production is planned from 2004, although first production chips will be delivered to customers in 2002.

Philips Semiconductors, which has annual revenues of approximately US$5 billion, designs and manufactures semiconductors and silicon systems platforms. Philips Semiconductors is spearheading the emerging field of systems on silicon solutions with the innovative Nexperia™ platform and VLSI Velocity™ tool set. The company's Sea-of-IP™ design methodology allows plug and play intellectual property blocks for easily customizable products. The company is a leader in communications, consumer, PC peripherals and automotive semiconductors, which are key applications for convergence in end-user products. Philips Semiconductors is headquartered in Eindhoven, The Netherlands, and has operations throughout the world.

Further details: www.philips.semiconductors.com